LAIPLA Spring Annual Meeting: Navigating the ITC

LAIPLA Annual Meeting and Patent Litigation Lunch event in Los Angeles

LAIPLA Spring Annual Meeting: Navigating the ITC

Wednesday, April 11, 2018
Sheppard Mullin

LAIPLA is proud to present “Navigating the ITC: Practical Advice For Bringing And Litigating ITC Actions” featuring a discussion with Michael Sandonato, a partner at Fitzpatrick, Cella, Harper & Scinto in New York and the chair of Fitzpatrick’s Electronics & Computer Technologies practice group. The event will feature a practical discussion of the pros and cons in filing a dispute at the ITC, and why the ITC can sometimes be a more attractive forum for a patent owner than a district court, given some of the present challenges in Federal Court litigation, among other topics of interest to any litigator in navigating the ITC.

**Los Angeles Intellectual Property Law Association (provider # 2083) certifies that this activity has been approved for MCLE credit by the State Bar of California in the amount of 1.0 hour.

PRICING

Judiciary: No Charge

In-House and Government Attorney: No Charge

Member: $45

Non-Member: $65

PANELISTS

Michael Sandonato
Fitzpatrick Cella, New York, NY

Michael chairs Fitzpatrick’s Electronics & Computer Technologies practice group, and has served as lead counsel in patent litigations in district courts across the country, in the International Trade Commission (ITC) and in Arbitrations. Michael is a graduate of Columbia Law School, holds an M.S. and B.S. in electrical engineering and is admitted to practice in New York and before the USPTO. Most recently, Michael filed an ITC action on behalf of client Canon Inc., along with three dozen companion district court cases across the country, for infringement of Canon’s patents covering laser toner cartridges. He is a regular speaker at ACI’s annual ITC Litigation & Enforcement Conference, and has sat on panels alongside Federal Circuit Judges, ITC ALJ’s and high ranking members of U.S. Customs and Border Protection,

Awards include: Exclusive winner of the 2018 Client Choice Award for IP – Patents in New York. Ranked in Chambers USA 2016 -2017 in Intellectual – Patent. Top practitioner in Litigation – Patent in the 2015-2018 editions of The Best Lawyers in America. Listed in the 2013-2017 issues of the IAM 1000 –The World’s Leading Patent Professionals. Listed in Legal 500 2012 – 2017 in Patent litigation: full coverage and Patent prosecution: utility and design patents. Listed as a Top New York City Intellectual Property Litigator in the 2009-2017 issues of Super Lawyers: New York Metro Edition.

2018 NOMINEES FOR THE BOARD AND OFFICERS

Pursuant to Sections 8.1 and 8.2 of the LAIPLA Bylaws, the 2016 LAIPLA Nominating Committee has selected the following slate of nominees for presentation at the Annual Meeting:

President: Laura M. Burson, Sheppard Mullin Richter & Hampton LLP
Vice President: Sarah S. Brooks, Stradling Yocca Carlson & Rauth, P.C.
Treasurer: Theodore W. Chandler, Sidley Austin LLP (second term)
Secretary: Ashe P. Puri, Fox Rothschild LLP
Board: Helen Omapas, HARMAN International
Board: David Randall, Brooks Kushman, P.C.
Board: Graham Cole, Proskauer Rose LLP

All of the director nominees as well as the new officer nominee have consented to serve. This year’s Nominating Committee consisted of the following LAIPLA Past Presidents: Paul D. Tripodi II, Wilson, Sonsini, Goodrich & Rosati; Marsha Diedrich, Alston & Bird LLP; and Scott Hansen, Viking Tech Law. Thank you for giving us this opportunity to participate in the LAIPLA Board and Officer nomination process. Pursuant to Section 8.3 of LAIPLA’s Bylaws, nominations of any or all of the offices to be filled at an annual election may be made by a petition signed by at least five Active Members entitled to vote, which petition shall be delivered to the Secretary prior to the Annual Meeting. Such nomination also may be made by any Active Member entitled to vote from the floor at the Annual Meeting.

LAIPLA encourages all members to attend the Annual Meeting and to get involved in LAIPLA.